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Chemtronics Lead Free No Clean De-Soldering Braid 1.5 m Length, 1.5 mm Width 60-2-5
Specifications
| Country of Origin | United States |
|---|---|
| Brand | Chemtronics |
| Length | 1.5m |
| Model | 60-2-5 |
| Width | 1.5mm |
| Chemtronics 1.5 m Lead Free No Clean De-Soldering Braid, Width 2mmBrand | Chemtronics |
| No clean desoldering wick,1.5m Lx1.5mm WBrand | Multicore |
Key Features
- Made from lead free materials ensuring environmental safety.
- Features a no clean flux that eliminates the need for post-solder cleaning.
- Packaged in static dissipative bobbins to protect against electrostatic discharge damage.
- Significantly reduces rework and repair time in electronics manufacturing.
- Minimizes the risk of damage to circuit boards during desoldering processes.
- Halide-free, non-corrosive organic flux formulation preserves component integrity.
- Suitable for removing solder from BGA pads and electronic chips effectively.
- Manufactured to United States standards for high reliability.
Product Description
Chemtronics 60-2-5 Lead Free No Clean De-Soldering Braid is a specialized solder wick designed for precision solder removal in electronics assembly and repair. With a 1.5 meter length and 1.5 mm width, this braid provides efficient desoldering performance with minimal risk to sensitive electronic components.
The braid's lead free composition adheres to modern environmental standards while the no-clean flux eliminates the need for additional cleaning after solder removal. The organic, halide-free flux is non-corrosive, preserving printed circuit boards and component pads during use.
Packaged in static dissipative bobbins, this product ensures protection against electrostatic discharge, making it suitable for delicate SMT and BGA applications. Using this braid reduces rework and repair time and improves the quality of solder joints in manufacturing and prototyping environments.
Typical uses include removing solder residue from BGA pads, SMD components, and circuit boards. Its patented flux technology facilitates clean solder removal without residue build-up or corrosion.
Lead free construction for environmental compliance and safety. No clean flux eliminates post-solder cleaning processes. Static dissipative packaging protects against ESD damage. Reduces rework and repair time in electronics manufacturing.
Non-corrosive, halide free, patented organic flux preserves component integrity. Ideal for BGA pad and chip solder removal applications. Manufactured in the United States to exacting quality standards.
This de-soldering braid is essential for industrial, laboratory, electronic repair, and manufacturing environments requiring precision and reliability in solder removal. Explore more Soldering Accessories and tools on EnvMart for enhanced electronics fabrication and maintenance solutions.
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Frequently Asked Questions
The Chemtronics Lead Free No Clean De-Soldering Braid has a length of 1.5 meters and a width of 1.5 mm.
This braid is made from lead-free materials and features a halide-free, non-corrosive organic flux formulation.
The no clean flux eliminates the need for post-solder cleaning, simplifying the solder removal process and saving time.
It is packaged in static dissipative bobbins to protect against electrostatic discharge damage.
It is suitable for removing solder from BGA pads, SMD components, and circuit boards in electronics manufacturing and repair.
Using this braid reduces rework and repair time while improving the quality of solder joints during assembly and prototyping.
This product is manufactured in the United States to high reliability standards.
The model number of this de-soldering braid is 60-2-5.
No, the flux is non-corrosive, which helps preserve the integrity of printed circuit boards and component pads during use.
The design of the braid minimizes the risk of damage to circuit boards during the desoldering process by using a gentle, effective flux.
The lead-free composition ensures compliance with modern environmental standards, promoting safety and environmental responsibility.
It is effective for removing solder from various types of solder joints, including those on BGA pads and electronic chips.
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