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Chemtronics 1.5 m Lead Free No Clean De-Soldering Braid Width 5.3mm 60-6-5

Category Soldering Accessories Brand Chemtronics Condition New

Specifications

Country of Origin United States
Brand Chemtronics
Length 1.5m
Model 60-6-5
Width 5.3mm
Chemtronics 1.5 m Lead Free No Clean De-Soldering Braid, Width 2.8mmBrand Chemtronics
Chemtronics 1.5m No Clean Desoldering Braid, Width 3.7mmBrand Chemtronics

Key Features

  • Features a width of 5.3 mm for precise desoldering applications.
  • Implements patented non-corrosive, halide free, organic no-clean flux technology.
  • Lead free and no-clean flux composition ensures environmental compliance.
  • Packaged in static dissipative bobbins to protect against electrostatic damage.
  • Minimizes rework and repair time through efficient solder removal.
  • Ideal for removing solder from BGA pads and chips with advanced wick design.
  • Manufactured in the United States, assuring quality and reliability.
  • Suitable for industrial electronics repair, soldering, and rework tasks.

Product Description

Chemtronics 60-6-5 is a 1.5 m Lead Free No Clean De-Soldering Braid with a width of 5.3 mm designed for precise and efficient solder removal in electronic assembly and repair. Featuring patented non-corrosive, halide free, organic no-clean flux, this braid minimizes damage to circuit boards while reducing rework and repair times.

The braid is carefully packaged in static dissipative bobbins, protecting sensitive electronic components from electrostatic discharge. Its lead free and no-clean flux composition aligns with environmental and safety standards, making it suitable for modern electronics manufacturing and repair environments.

This product is especially effective for removing solder from Ball Grid Array (BGA) pads and chips, providing a reliable wick and braid solution optimized for delicate electronics work. Manufactured in the United States, it offers consistent quality and performance.

Applications include industrial electronics manufacturing, laboratory rework, PCB repair, and maintenance tasks where solder removal is required without risking component or board damage.

Width of 5.3 mm ensures precision in solder wick applications. Length of 1.5 m provides ample material for multiple uses. Non-corrosive and halide free flux prevents substrate damage during solder removal. No clean flux eliminates the need for additional cleaning after desoldering.

Static dissipative packaging enhances safety in sensitive electronics environments. Lead free formulation complies with RoHS and other environmental regulations. Easy-to-use desoldering braid ideal for BGA pads and chip solder removal.

Choose Chemtronics 60-6-5 De-Soldering Braid for a dependable and efficient solution in solder removal, backed by high-quality US manufacturing standards. Explore more Soldering Accessories and power tools at EnvMart to support your industrial and electronics repair needs.

Chemtronics 1.5 m Lead Free No Clean De-Soldering Braid Width 5.3mm 60-6-5
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Frequently Asked Questions

The de-soldering braid has a width of 5.3 mm, which is designed for precise solder removal applications.

This model has a length of 1.5 m, providing ample material for multiple solder removal tasks.

It implements patented non-corrosive, halide free, organic no-clean flux technology, which minimizes damage to circuit boards during solder removal.

Yes, this de-soldering braid is lead free, ensuring compliance with environmental regulations such as RoHS.

It is suitable for industrial electronics manufacturing, laboratory rework, PCB repair, and maintenance tasks where solder removal is required.

The braid is packaged in static dissipative bobbins, which protect sensitive electronic components from electrostatic discharge.

Yes, it is especially effective for removing solder from Ball Grid Array (BGA) pads and chips due to its advanced wick design.

This product is manufactured in the United States, assuring quality and reliability.

The no-clean flux eliminates the need for additional cleaning after desoldering, making the process more efficient.

Its primary feature is the use of a lead free and no-clean flux composition that minimizes damage to circuit boards while ensuring environmental compliance.

The organic no-clean flux is designed to prevent substrate damage during solder removal, enhancing the safety of the operation.

It minimizes rework and repair time through efficient solder removal, making it ideal for various electronic repair tasks.

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