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Weller Lead Free Solder Wire 1 mm Diameter 250 g Spool Rosin Flux Core 217°C Melting Point T0051388699
Specifications
| Country of Origin | Japan |
|---|---|
| Brand | Weller |
| Model | T0051388699 |
| Melting Point | 217°C |
| Product Weight | 250g |
| Wire Diameter | 1mm |
| Product Form | Wire |
| Percent Lead | 0% |
| Percent Silver | 3% |
| Percent Tin | 96.5% |
| Flux Type | Rosin |
| Percent Copper | 0.5% |
| Weller Wire, 0.8 mm Lead Free Solder, 217 °C Melting PointBrand | Weller |
Key Features
- This solder wire is lead free with 0% lead content for compliance with lead avoidance requirements.
- The alloy composition includes 96.5% tin, 3% silver, and 0.5% copper to improve mechanical strength and ductility.
- Rosin flux core enables low-residue soldering suitable for delicate electronic applications.
- Suitable for automated dispensers and manual wave or selective soldering processes.
- Provides reliable joints for SMT and through-hole components in industrial electronics.
- Product originates from Japan and meets typical industrial quality standards without additional certifications.
Product Description
Weller T0051388699 Lead Free Solder Wire features a 1 mm diameter rosin-flux cored wire supplied on a 250 g spool, optimized for industrial electronic assembly and repair applications.
It is specifically formulated without lead content (0%) to meet environmental and regulatory requirements where lead-free soldering is mandatory.
The alloy consists of 96.5% tin, 3% silver, and 0.5% copper. The silver content enhances joint ductility and fatigue resistance, while the copper reduces whisker formation and strengthens mechanical integrity. The solder melts at 217 °C ensuring consistent reflow across standard soldering irons and equipment.
The rosin flux core produces minimal residues, reducing cleaning effort and protecting sensitive electronic components. This product suits manual and automated soldering processes including wave and selective soldering in manufacturing and maintenance environments.
Typical applications include repairs and assembly on SMT and through-hole printed circuit boards, as well as joining silver-bearing component leads in electronic control systems and automation modules.
Lead-free compliant solder wire with 0% lead for environmental safety. Optimized alloy for enhanced mechanical and thermal performance. Rosin flux core provides low-residue, high-reliability solder joints. Consistent melting temperature of 217 °C for precise soldering control.
Suitable for use in industrial, manufacturing, maintenance, and electronics laboratory settings. Supplied on a 250 g spool ideal for small to medium repair batches. This solder wire is manufactured in Japan, reflecting high-quality production standards.
Explore more industrial soldering materials and tools in EnvMart’s Power Tools > Solder Wire category for professional workshop and production needs.
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Frequently Asked Questions
The solder wire has a diameter of 1 mm.
The melting point of this solder wire is 217 °C.
The alloy composition includes 96.5% tin, 3% silver, and 0.5% copper, with 0% lead content for compliance with lead avoidance requirements.
This solder wire features a rosin flux core, which enables low-residue soldering suitable for delicate electronic applications.
The solder wire is supplied on a 250 g spool.
This solder wire is manufactured in Japan.
The silver content enhances joint ductility and fatigue resistance, while the copper reduces whisker formation and strengthens mechanical integrity.
The solder wire has 0% lead content, making it compliant with environmental and regulatory requirements where lead-free soldering is mandatory.
It provides reliable joints for SMT and through-hole components in industrial electronics, ensuring high-quality soldering for electronic assemblies.
Yes, the 250 g spool is ideal for small to medium repair batches in various electronic applications.
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