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Wurth Elektronik Thermal Gap Pad 0.15 mm Thick 5 W/mK Ceramic Filled Silicone Rubber 100 mm x 100 mm 40115005
Specifications
| Country of Origin | India |
|---|---|
| Brand | Wurth Elektronik |
| Colour | White |
| THICKNESS | 0.15mm |
| Length | 100mm |
| Model | 40115005 |
| Width | 100mm |
| Series | WE-TGF |
| Maximum Operating Temperature | 150°C |
| Hardness | 35 Shore C |
| Thermal Conductivity | 5W/mK |
| Minimum Operating Temperature | -50°C |
| Trade Name | Würth Elektronik eiSos GmbH & Co. KG |
| Conductive Material | Ceramic Filled Silicone Rubber |
Key Features
- Designed to provide an efficient thermal interface between heatsinks and electronic devices.
- Thickness of 0.15 mm ensures effective heat transfer over air gaps and uneven surfaces.
- Constructed from ceramic filled silicone rubber for enhanced thermal conductivity and durability.
- Operates within a temperature range of -50°C to 150°C, suitable for demanding environments.
- Hardness rating of 35 Shore C provides balanced mechanical compliance.
- White color and compliance with RoHS and REACh standards ensure environmental safety.
- Excellent for applications requiring reliable thermal management in electronics and HVAC systems.
Product Description
Wurth Elektronik 40115005 Thermal Gap Pad is a high-performance thermal interface material designed to improve heat dissipation between heatsinks and electronic components. Constructed from ceramic filled silicone rubber, this pad combines excellent thermal transfer with mechanical durability, making it an ideal solution for advanced electronic cooling applications.
The pad measures 100 mm in length and width, providing ample coverage for various device sizes. It maintains functionality in a wide operating temperature range from -50°C to 150°C, supporting diverse industrial environments. The hardness of 35 Shore C allows the pad to conform to surface irregularities without excessive compression, thereby sustaining consistent thermal contact over time.
This product complies with stringent environmental regulations including RoHS (2011/65/EU & 2015/863) and REACh (EC 1907/2006), ensuring safe use in sensitive electronic assemblies. Its white coloration helps with visual inspection and product identification during assembly processes.
Thermal gap pads from Wurth Elektronik are essential for applications in the electronics industry, HVAC systems, thermal management in manufacturing, laboratory instruments, and other industrial setups where thermal efficiency must be maximized without the mess of greases or pastes.
Technical and industrial users will find this pad particularly useful for ensuring thermal conductivity and preventing device overheating, contributing to enhanced component lifespan and performance reliability.
Designed for optimal thermal interface efficiency between heatsinks and electronic devices. Durable ceramic filled silicone rubber construction. Effective over temperature ranges from -50°C to 150°C. Complies with RoHS and REACh environmental standards.
Standard dimensions of 100 mm by 100 mm and thickness of 0.15 mm. Hardness of 35 Shore C ensures mechanical stability and compliance. Explore further thermal management solutions and other electronics components at EnvMart.
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Frequently Asked Questions
The thermal gap pad has a thickness of 0.15 mm, ensuring effective heat transfer over air gaps and uneven surfaces.
It has a thermal conductivity rating of 5 W/mK, which enhances its ability to transfer heat efficiently between components.
The pad measures 100 mm in length and 100 mm in width, providing ample coverage for various electronic devices.
This model operates within a temperature range of -50°C to 150°C, making it suitable for demanding industrial environments.
It is constructed from ceramic filled silicone rubber, which provides both thermal conductivity and mechanical durability.
The hardness rating of this pad is 35 Shore C, allowing it to conform to surface irregularities while maintaining stability.
Yes, it complies with RoHS and REACh standards, ensuring safe use in sensitive electronic assemblies.
The pad is white in color, which aids in visual inspection and product identification during assembly processes.
It is excellent for applications requiring reliable thermal management in electronics, HVAC systems, and thermal management in manufacturing.
The country of origin for this product is India.
This model belongs to the WE-TGF series, which is designed for thermal interface applications.
By ensuring consistent thermal contact, it helps prevent overheating, thereby enhancing component lifespan and performance reliability.
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