Chemtronics Lead Free No Clean De-Soldering Braid Width 2.8mm Length 1.5m 80-4-5

Chemtronics 80-4-5 Lead Free No Clean De-Soldering Braid features a 2.8mm width and 1.5m length, engineered to facilitate precise and clean removal of solder from electronic components and circuit boards. It utilizes an organic, lead free, no-clean flux formula that is halide free and non-corrosive, making it ideal for use in sensitive electronics manufacturing, rework, and repair.

This de-soldering braid is packaged on static dissipative bobbins that help reduce the risk of electrostatic discharge damage to delicate components. The braid reduces the time needed for solder removal and ensures minimal risk of damage to the underlying circuit board, enhancing repair reliability and efficiency.

Chemtronics 80-4-5 is especially suited for removing solder from BGA pads and chips, providing excellent wicking performance. Its no-clean characteristics eliminate the need for additional cleaning, saving time and resources during assembly or rework processes.

This product is manufactured in the United States, adhering to strict quality and safety standards. It is an essential tool in industrial electronics assembly, repair, and manufacturing applications, valuable in environments focused on precision and safety.

Patented non-corrosive, halide-free, organic no-clean flux. Lead free and no-clean design for environmentally safer soldering. Static dissipative bobbin packaging to protect components. Reduces rework and repair time significantly.

Minimizes risk of board damage during desoldering. Suitable for Ball Grid Array (BGA) pads and chips. Made in the United States for assured quality. For a variety of industrial soldering and desoldering tools and accessories, explore the Soldering Accessories category at EnvMart.