KEMET 1.8 pF 50V dc C0G Dielectric Multilayer Ceramic Capacitor Surface Mount 0402 Package C0402C189C5GACTU

KEMET C0402C189C5GACTU is a high-quality multilayer ceramic capacitor (MLCC) featuring 1.8 pF capacitance with a 50V dc voltage rating and a low tolerance of 0.25 pF. It incorporates a C0G dielectric known for exceptional thermal stability with capacitance variation limited to ±30 ppm/°C over the temperature range from -55°C to +125°C. This capacitor is designed for surface mounting on PCBs and is part of the C0402C series, making it suitable for compact electronic assemblies requiring precise and stable capacitance.

The capacitor is constructed using a stacked layer design within a 0402 package case (1 mm length x 0.5 mm width x 0.5 mm height). It features lead-free solder termination, ensuring environmental compliance and easy integration into automated assembly processes. Packaging on paper tape reel formats allows convenient use in high-volume manufacturing.

Standards met include J-STD-020, EIA 481, and IPC-7351, guaranteeing high product reliability and adherence to industry requirements. This capacitor offers extremely low equivalent series resistance (ESR) and inductance (ESL), no piezoelectric noise, and high ripple current capabilities.

KEMET’s C0G dielectric capacitors are widely used in industrial electronics, telecommunications equipment, consumer electronics, and instrumentation where capacitance stability and reliability are critical. The product's maximum operating temperature is 125°C, and the minimum operating temperature is -55°C, allowing operation in harsh environmental conditions.

This component supports a broad range of DC voltage ratings, but this model specifically supports up to 50V dc. Its tight tolerance and stable characteristics make it ideal for high-precision filter, timing, and coupling applications.

Capacitance value of 1.8 pF with a tolerance of 0.25 pF. C0G dielectric ensures negligible capacitance change over -55°C to 125°C. Stacked construction in a 0402 surface mount package (1 x 0.5 x 0.5 mm). Lead-free solder termination for RoHS compliance.

Paper tape packaging supports high-volume manufacturing. Conforms to J-STD-020, EIA 481, IPC-7351 standards. Extremely low ESR and ESL for high-frequency applications. Absence of piezoelectric noise for sensitive circuits.

High ripple current capability for reliable operation. Manufactured in Mexico.

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