KEMET 10 pF 100V dc ±5% Tolerance Multilayer Ceramic Capacitor Surface Mount 0805 Package C0805C100J1GACTU

KEMET C0805C100J1GACTU is a 10 pF multilayer ceramic capacitor designed for surface mount applications, rated for 100V dc with ±5% capacitance tolerance. It features a stacked construction and a compact 0805 package case size measuring 2 mm length, 1.25 mm width, and 0.78 mm height. With a dielectric type of C0G (Class I), this capacitor ensures ultra-stable, low-loss performance suitable for high precision electronic circuits.

The capacitor is designed to operate reliably within a temperature range from -55°C minimum to a maximum of 125°C, supporting demanding industrial, laboratory, and commercial electronics uses. Its termination is a solder type with nickel barrier coated with tin plating to provide robust and corrosion-resistant connections on PCB pads.

Standards and approvals met by this capacitor include EIA 481, EIA 556, EIA 624, IPC-7351, and J-STD-020, confirming its quality for electronic component manufacturing and assembly.

The 0805 package size and tape & reel packaging optimize it for automated pick-and-place processing, improving production efficiency in industries like consumer electronics, telecommunications, and embedded system manufacturing.

This KEMET MLCC is highly suitable for use in mobile phones, video and tuner designs, as well as general decoupling applications requiring high stability and low dielectric loss. The capacitor’s robust specifications make it an excellent component for industrial quality electronic devices and PCB designs.

This capacitor utilizes a stacked construction for reliable performance. The surface mount package case size is 0805, suitable for compact PCB designs. Dielectric is C0G providing ultra-stable, low loss characteristics. Operating temperature ranges from -55°C to 125°C.

Termination type is solder with nickel barrier and tin plating for effective connectivity. Standards compliance includes EIA 481, 556, 624, IPC-7351, and J-STD-020. It is ideal for high precision and decoupling applications in electronics manufacturing.

Package is tape and reel for automated assembly processes.

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