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Syfer Technology 100 nF Multilayer Ceramic Capacitor 50V dc ±5% Tolerance Surface Mount 0805 Package 0805Y0500104JXT
Specifications
| Country of Origin | India |
|---|---|
| Voltage | 50V dc |
| Brand | Syfer Technology |
| Height | 1.3mm |
| Length | 2mm |
| Model | 0805Y0500104JXT |
| Width | 1.25mm |
| Construction | Stacked |
| Series | Flexicap |
| Termination Type | Surface Mount |
| Maximum Operating Temperature | 125°C |
| Tolerance | ±5 % |
| Capacitance | 100nF |
| Minimum Operating Temperature | -55°C |
| Standards/Approvals | IECQ-CECC, RoHS, ISO 14001, OHSAS 18001 |
| Package/Case | 0805 |
| Dielectric | X7R |
| Automotive Standard | AEC-Q200 |
Key Features
- Constructed with X7R dielectric for temperature stability.
- Features a stacked construction with a 0805 package size.
- Supports automotive-standard AEC-Q200 for reliability in automotive environments.
- Minimum operating temperature of -55°C and maximum temperature of 125°C.
- Surface mount termination with nickel barrier finish and plated tin layer.
- Flexicap series designed to accommodate board bending and resist cracking during thermal cycling.
- Compatible with wave and reflow solder techniques without equipment adjustment.
- Meets IECQ-CECC, RoHS, ISO 14001, and OHSAS 18001 standards and approvals.
Product Description
Syfer Technology 0805Y0500104JXT Multilayer Ceramic Capacitor is a 100 nF capacitance component rated for 50V dc applications, featuring a tolerance of ±5%. This capacitor uses a stacked construction with an 0805 package size, making it suitable for compact electronic assemblies requiring reliable performance and temperature stability enabled by the X7R dielectric.
The capacitor conforms to automotive-standard AEC-Q200, ensuring durability and reliability in automotive and other demanding industrial applications. It operates over a wide temperature range from -55°C to 125°C, supporting thermal cycling of over 1000 cycles without cracking, thanks to its proprietary Flexicap technology.
Flexicap capacitors employ a flexible epoxy polymer termination material over a nickel barrier finish with plated tin, which accommodates board flexing stresses better than conventional MLCCs. This makes them highly suitable for mobile phone designs, video and tuner circuits, and other electronic components requiring robust surface mount capacitors.
The device dimensions are precisely 2 mm in length, 1.25 mm in width, and 1.3 mm in height, compliant with standard 0805 case sizes. Termination is optimized for wave and reflow solder processes without any need for adjustments in manufacturing equipment.
This component meets key environmental and quality standards including IECQ-CECC, RoHS, ISO 14001, and OHSAS 18001, making it well suited for use in industrial, automotive, telecommunications, and consumer electronics sectors.
Constructed with X7R dielectric for stability over a range of temperatures. Automotive-grade AEC-Q200 certified for enhanced reliability. Flexicap termination technology allows resistance to board flex and thermal shock.
Surface mount design in standard 0805 package footprint. Extended operating temperature range from -55°C to 125°C. Compliant with international quality and environmental standards. Suitable for mobile, video, tuner, and general-purpose electronic applications.
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Frequently Asked Questions
This model has a capacitance value of 100 nF.
It is rated for a maximum voltage of 50V dc.
The tolerance for this capacitor is ±5%.
It operates over a temperature range from -55°C to 125°C.
It is constructed with an X7R dielectric, which provides temperature stability.
The dimensions are 2 mm in length, 1.25 mm in width, and 1.3 mm in height, compliant with the 0805 package size.
This model features a surface mount termination with a nickel barrier finish and a plated tin layer.
Yes, it conforms to the automotive-standard AEC-Q200, ensuring reliability in automotive environments.
It meets IECQ-CECC, RoHS, ISO 14001, and OHSAS 18001 standards and approvals.
The capacitor features a stacked construction, which enhances its performance in compact electronic assemblies.
Flexicap technology allows the capacitor to accommodate board bending and resist cracking during thermal cycling, making it suitable for demanding applications.
It is compatible with wave and reflow solder techniques without any need for adjustments in manufacturing equipment.
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