AAVID THERMALLOY Heatsink for Thin Components Power Semiconductors Sensors Black Anodised Nickel Plated 85.5 mm x 0SA36/50/B

AAVID THERMALLOY 0SA36/50/B heatsink is specifically engineered for thin components, power semiconductors, and sensors, providing exceptional thermal management in demanding environments. Its compact dimensions of 85.5 mm height, 50 mm length, and 49.5 mm width fit a variety of semiconductor packages such as TO-0247, TO-0247J, TO-0218, TO-0220, TO-220, and TO-247.

Constructed from premium nickel plated special spring steel, this heatsink combines mechanical strength with excellent thermal conductivity. The black anodised nickel plating serves to resist corrosion and enhance durability during extended use in industrial, electronic manufacturing, HVAC, and laboratory equipment applications.

The heatsink employs the Max Clip System™ OSA36 profile clip mounting technology, facilitating simplified and rapid assembly while ensuring high reliability. This system replaces traditional rivets and screws, resulting in economic manufacturing benefits and improved device performance. The innovative design supports usage with special thermal interface materials to optimize heat transfer efficiency.

With a thermal resistance rating of just 1.95 K/W, the heatsink effectively dissipates heat emitted from sensitive electronic components, protecting power semiconductors and sensors from thermal damage and improving overall device longevity.

Constructed from nickel plated special spring steel. Max Clip System™ OSA36 profile clip mounting for quick installation. Thermal resistance of 1.95 K/W for efficient heat dissipation. Compatible with multiple semiconductor package types including TO-220 variants.

Dimensions: 85.5 mm height × 50 mm length × 49.5 mm width. Black anodised, nickel plated finish for corrosion resistance. Protected under U.S. Patent 5.991.151. Applicable in industrial electronics, HVAC, and laboratory instrumentation.

Enhances semiconductor cooling and sensor performance.

This heatsink is suitable for professionals and engineers working in electronics manufacturing, industrial automation, and thermal management applications. Its robust design and patented clip system streamline assembly processes while delivering reliable thermal control.

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