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Fischer Elektronik Heatsink Universal Square Aluminium 27.4K/W Thermal Resistance 10 mm x 14 mm x 14 mm ICK BGA 14x14x10

Category Heatsink Brand Fischer Elektronik Condition New

Specifications

Country of Origin Germany
Brand Fischer Elektronik
Material Aluminium
Colour Black
Height 10mm
Length 14mm
Model ICK BGA 14x14x10
Finish Black Anodised
Width 14mm
Thermal Resistance 27.4K/W
For Use With Universal Square Alu
Fastening Clamp, Glue, Integrated clamp, Screw, Thermally conductive adhesive
Compatible Package Type BGA
RS PRO Heatsink, Universal Rectangular Alu, 27K/W 10 mm 13 mm 13.5mmBrand RS PRO

Key Features

  • Constructed from black anodised aluminium for optimal heat conduction and corrosion resistance.
  • Compatible with BGA package type components for precise thermal management.
  • Fastening options include clamp, glue, integrated clamp, screw, and thermally conductive adhesive.
  • Designed to be mounted directly on BGA components using thermal adhesive or conductive foil (not included).
  • Manufactured in Germany ensuring high quality and reliability.
  • Suitable for electronics cooling in industrial, laboratory, and HVAC applications.
  • Offers a thermal resistance rating of 27.4 K/W to efficiently dissipate heat.
  • Compact and universal square form factor of 14 mm x 14 mm base size.

Product Description

Fischer Elektronik presents the ICK BGA 14x14x10 heatsink, a precision-engineered universal square aluminium heatsink designed to aid in effective heat dissipation of IC processors. Featuring a thermal resistance of 27.4 K/W, this heatsink measures 10 mm in height with a square base of 14 mm by 14 mm, making it suitable for compact electronics cooling applications.

This product is constructed from black anodised aluminium, which offers excellent thermal conductivity alongside corrosion resistance and a resilient surface finish. The heatsink is specifically compatible with Ball Grid Array (BGA) package types and can be fastened securely using clamp, glue, integrated clamp, screws, or thermally conductive adhesives, providing versatile mounting options depending on your application requirements.

The ICK BGA series heatsinks are designed for direct application onto BGA components using thermal adhesive or thermally conductive foil (sold separately). This direct mounting optimizes thermal transfer, thereby enhancing the efficiency of heat dissipation in electronic circuits.

Manufactured in Germany, the heatsink ensures high quality and reliability suitable for a wide range of industrial uses including electronics manufacturing, laboratory instrumentation cooling, telecommunications hardware, and HVAC system electronic module management.

Black anodised aluminium construction ensures durability and superior heat transfer. Compact square form factor matches BGA package dimensions precisely. Wide fastening method compatibility facilitates flexible installation.

High thermal resistance of 27.4 K/W supports efficient cooling performance. Manufactured in Germany adhering to stringent quality standards. Ideal for industrial, laboratory, HVAC, and manufacturing thermal control applications.

This Fischer Elektronik heatsink is a vital component for effective thermal management in electronic assemblies where heat buildup could impair performance or lifespan. Proper use of this heatsink contributes significantly to device reliability and operational safety.

Explore more precision-engineered Heatsinks and thermal management solutions in the Electronics Components category on EnvMart to enhance your projects and industrial applications.

Fischer Elektronik Heatsink Universal Square Aluminium 27.4K/W Thermal Resistance 10 mm x 14 mm x 14 mm ICK BGA 14x14x10
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Frequently Asked Questions

The thermal resistance of this heatsink is 27.4 K/W, which aids in efficient heat dissipation.

This heatsink has a height of 10 mm and a square base measuring 14 mm by 14 mm.

It is constructed from black anodised aluminium, providing good thermal conductivity and corrosion resistance.

This model is specifically compatible with Ball Grid Array (BGA) package types.

It can be fastened using clamp, glue, integrated clamp, screws, or thermally conductive adhesive.

This heatsink is manufactured in Germany, ensuring high quality and reliability.

It is suitable for electronics cooling in industrial, laboratory, and HVAC applications.

The heatsink features a black anodised finish for enhanced thermal management and durability.

It is designed to be mounted directly on BGA components using thermal adhesive or conductive foil, which enhances thermal transfer efficiency.

The model number of this heatsink is ICK BGA 14x14x10.

The height of this heatsink is 10 mm.

This heatsink is primarily designed for BGA package types, and its compatibility with other types is not specified.

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