RS PRO Heatsink for High-Power Electronics, PCBs, BGA Chips, LEDs, Black Anodised Aluminium, 25 mm x 35 mm x 25 mm 234-2356

RS PRO 234-2356 Heatsink is a precision-engineered component designed for effective thermal management in high-power electronics applications including PCBs, BGA chips, and LEDs. This heatsink features a black anodised aluminium construction that facilitates efficient heat dissipation, thereby improving device reliability and performance.

Measuring 25 mm in length, 35 mm in width, and 25 mm in height, the heatsink is tailored for compact mounting in electronic assemblies. The clip fastening ensures quick and secure attachment to components, making it suitable for both prototype and production environments.

With a thermal resistance of 9°C/W, this heatsink effectively reduces the operating temperature of semiconductor and optoelectronic devices, preventing performance degradation and extending component life. The thermal resistance value is specified with fins positioned vertically in free air to replicate realistic operating conditions.

RoHS compliance affirms the product's environmental compatibility, minimizing hazardous substances. The black anodised finish not only enhances thermal conduction but also protects against corrosion and mechanical wear.

Manufactured in the United Kingdom, the RS PRO 234-2356 ensures superior quality and consistency, making it a reliable choice for industrial, laboratory, HVAC, and electronic manufacturing applications.

Constructed from black anodised aluminium for excellent heat dissipation. Dimensions are 25 mm length, 35 mm width, and 25 mm height for effective thermal management. Fastening method is via clip for secure and easy installation.

RoHS compliant, ensuring adherence to environmental standards. Ideal for high power semiconductor and optoelectronic devices. Thermal resistance measured with fins vertical in free air for accuracy. Finished in black anodised coating to increase durability and corrosion resistance.

Manufactured in the United Kingdom ensuring quality standards.

This heatsink is suitable for use in electronics assembly, especially where thermal management of power semiconductors, PCBs, LEDs, and BGA chips is critical. It is widely applicable in industrial electronics, automotive systems, telecommunications, and HVAC equipment.

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