Amphenol Communications Solutions 44 Way Straight 2.29 mm Pitch Through Hole D-Sub Connector Female 10090929-S444XLF

Amphenol Communications Solutions 10090929-S444XLF is a 44 Way Straight 2.29 mm Pitch Through Hole D-Sub Connector Female designed to provide reliable and robust connectivity for demanding applications.

The connector features a high-density contact arrangement of 44 contacts with precise 2.29 mm pitch, ensuring compactness without compromising connection integrity.

Its thermoplastic housing protects the internal contacts made from copper alloy plated with gold over nickel, enhancing durability and corrosion resistance. Rated for 2.5A current and 250V voltage, this connector operates efficiently in temperatures ranging from -55°C to 105°C, making it suitable for industrial, telecommunications, data, military, instrumentation, and medical equipment.

Featuring a straight orientation and through-hole mount type, it guarantees a secure and robust connection to printed circuit boards. The connector uses solder termination type for excellent electrical contact integrity and includes UNC 4-40 clinch nuts with board locks to prevent loosening under vibration or mechanical stress.

This high density D-Sub connector complies with industry standards and is engineered for applications requiring high-speed interfaces and compact designs like Ethernet, USB, HDMI, and PCMCIA systems.

This D-Sub Connector features 44 contacts with a 2.29 mm pitch for reliable signal transmission. Constructed with thermoplastic housing and copper alloy contacts plated with gold over nickel for durable performance. Supports a maximum current of 2.5A and operating voltage up to 250V.

Operates reliably in temperatures from -55°C to 105°C, suitable for harsh environments. Connector has a straight orientation with through-hole mounting for secure PCB assembly. Termination type is solder, ensuring strong electrical connections.

Includes UNC 4-40 clinch nuts with board locks for robust mechanical fastening. Ideal for industrial, telecommunications, instrumentation, and medical applications requiring high-density interconnects. This product is made in China and offers a reliable solution for high-density board-level interconnections in industrial and electronic component applications.

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