Power Adhesives Black Polyamide Potting Compound Stick TEC-BOND 2min Setting Time 135°C Max 7718-12-250-BKP-TP10-RS

Power Adhesives 7718-12-250-BKP-TP10-RS is a black polyamide potting compound supplied as a stick, designed for industrial encapsulating and protecting electronic and mechanical assemblies. It is a hotmelt adhesive with very low viscosity allowing it to run smoothly through standard 12mm glue guns, simplifying application compared to traditional epoxy or polyurethane compounds which require mixing and contain hazardous chemicals.

The product features a rapid setting time of 2 minutes, enabling fast assembly and reduced downtime in manufacturing or repair workflows. Its operating temperature range from -10°C to 135°C makes it suitable for a diverse range of environmental conditions including industrial, construction, and electrical applications.

This potting compound complies with UL V0 standards for flame retardancy, RoHS for hazardous substance restrictions, and EN 60234-1, ensuring high safety and regulatory compliance. Its polyamide base chemistry offers excellent encapsulation and protection to sensitive components from dust, moisture, vibration, and thermal stress.

Packaged securely in sealed foil sticks, it maintains a shelf life of 12 months or longer when stored properly, providing reliability and long-term usability for maintenance and manufacturing teams. The viscosity of 950 CPS enables smooth flow during application, ensuring consistent coverage and bonding.

Designed for use in mechanical, fluid power, and electronic sealing tasks, it protects assemblies used in industrial machinery, HVAC systems, water treatment equipment, and electrical enclosures, making it versatile for laboratory, manufacturing, and construction industries.

The compound is easy to apply with standard glue guns suitable for 12mm sticks. Offers fast setting time of approximately 2 minutes to speed up potting processes. Wide operating temperature range from -10°C to 135°C suitable for harsh environments.

Meets UL V0, RoHS, and EN 60234-1 standards ensuring safety and compliance. Polyamide base ensures strong adhesion and protection from mechanical and environmental stresses. Comes in foil pouch packaging for extended shelf life and easy storage.

Low viscosity of 950 CPS supports smooth and uniform application. Ideal for electrical, mechanical, and fluid power encapsulation in industrial settings. Explore EnvMart’s comprehensive range of Potting Compounds and industrial adhesives for your specialized applications.